Bourns SinglFuse SF-2410FP100W-2 Cross UL 248-14 Precision Wire Core Surface Mount Fuses SEF 1.0A Fast Acting 2410
Application
LCD / LED TVs
White goods
PC servers
LCD monitors
DC/DC converters
DC/AC inverters
Notebooks / ultrabooks
Telecom systems
Chargers
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Features
Single blow fuse for overcurrent protection
6125 (EIA 2410) footprint
Fast acting precision
UL 248-14 listed
RoHS compliant* and halogen free
Wire core SMD design
Surface mount packaging for automated assembly
Dimension
Part Numbering
Catalog No. |
Ampere Rating |
Voltage Rating |
Breaking Capacity |
Nominal Cold Resistance (Ohms) |
I2TMelting Integral(A2.S) |
Agency Approvals | |
UL | CUL | ||||||
SEF0200 | 200mA | 250VAC |
50A@300VAC 50A@250VAC 200A@125VAC |
0.960 | 0.148 | ● | ● |
SEF0250 | 250mA | 0.860 | 0.145 | ● | ● | ||
SEF0300 | 300mA | 0.620 | 0.162 | ● | ● | ||
SEF0315 | 315mA | 0.550 | 0.189 | ● | ● | ||
SEF0375 | 375mA | 0.470 | 0.200 | ● | ● | ||
SEF0400 | 400mA | 0.380 | 0.238 | ● | ● | ||
SEF0500 | 500mA | 0.320 | 0.275 | ● | ● | ||
SEF0600 | 600mA | 0.285 | 0.470 | ● | ● | ||
SEF0630 | 630mA | 0.256 | 0.566 | ● | ● | ||
SEF0700 | 700mA | 0.208 | 0.805 | ● | ● | ||
SEF0750 | 750mA | 0.175 | 1.240 | ● | ● | ||
SEF0800 | 800mA | 0.155 | 1.880 | ● | ● | ||
SEF1100 | 1A | 0.148 | 3.500 | ● | ● | ||
SEF1125 | 1.25A | 0.102 | 4.760 | ● | ● | ||
SEF1150 | 1.5A | 0.085 | 6.305 | ● | ● | ||
SEF1200 | 2A | 0.044 | 8.950 | ● | ● | ||
SEF1250 | 2.5A | 0.043 | 16.025 | ● | ● | ||
SEF1300 | 3A | 0.033 | 21.560 | ● | ● | ||
SEF1315 | 3.15A | 0.029 | 22.750 | ● | ● | ||
SEF1350 | 3.5A | 0.027 | 27.050 | ● | ● | ||
SEF1400 | 4A | 0.025 | 31.808 | ● | ● | ||
SEF1500 | 5A | 0.019 | 40.250 | ● | ● | ||
SEF1600 | 6A | 0.018 | 67.245 | ● | ● | ||
SEF1630 | 6.3A | 0.017 | 73.550 | ● | ● | ||
SEF1700 | 7A | 0.015 | 76.280 | ● | ● |
Environmental Characteristics
Operating Temperature | -55 °C to +125 °C |
Storage Conditions Temperature | +5 °C to +35 °C |
Humidity | 40 % to 75 % |
Shelf Life | 2 years from manufacturing date |
Moisture Sensitivity Level | 1 |
ESD Classification (HBM) | Class 6 |
Times Performances
% of Ampere Rating(In) |
Blowing Time |
100% * In | 4 hours Min |
200% * In | 120 sec Max |
1000% * In | 10ms Min |
Average Time Current Curves
Reliability Testing
No. | Test | Requirement | Test Condition | Test Reference |
1 | Reflow and bend |
DCR change ≤ 20 % (≤ 10 % for ≤1 A) No mechanical damage |
3 reflows at 245 °C followed by a 2 mm bend |
Refer to STP document |
2 | Solderability | Minimum 90 % coverage | One dip at 245 °C for 5 seconds | MIL-STD-202 Method 208 |
3 | Soldering heat resistance |
DCR change ≤ 20 % (≤ 10 % for ≤1 A) New solder coverage ≤ 75 % |
One dip at 260 °C for 10 seconds | MIL-STD-202 Method 210 |
4 | Moisture resistance | DCR change ≤ ±15 % No excessive corrosion | 10 cycles | MIL-STD-202 Method 106 |
5 | Salt spray | DCR change ≤ ±10 % No excessive corrosion |
48 hour exposure, 5 % salt solution | MIL-STD-202 Method 101 |
6 | Mechanical vibration | DCR change ≤ ±10 % No mechanical damage |
0.4 inch D.A. or 30 G between 5-3000 Hz |
MIL-STD-202 Method 204 |
7 | Mechanical shock | DCR change ≤ ±10 % No mechanical damage |
1500 G, 0.5 ms, half-sine shocks | MIL-STD-202 Method 213 |
8 | Thermal Shock | DCR change ≤ ±10 % No mechanical damage |
100 cycles between -65 °C and +125 °C | MIL-STD-202 Method 107 |
9 | Life | No electrical “opens” during testing Voltage drop change shall be less than ±20 % of initial value |
80 % rated current (75 % for < 1 A fuses) for 2000 hours at ambient temperature +25 °C |
Refer to STP document |
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
Current Rating Thermal Derating Curve
Solder Reflow Recommendations
Reflow Condition | Pb-Free assembly | |
Average ramp-up rate (Ts(max)to Tp) | 5°C /second max. | |
Preheat | Temperature Min (Ts(min)) | 150°C |
Temperature Max (Ts(max)) | 200°C | |
Time (Min to Max) (ts) | 60-120 seconds | |
Reflow | Temperature (TL) | 220°C |
Time Max (tL) | 60 seconds | |
Peak Temperature(Tp) | 260°C max | |
Ramp-down Rate | 5°C/second max | |
Time 25°C to peak Temperature (Tp) | 8 minutes max |
Recommended Temperature Profile for Wave Soldering
Wave soldering is suitable for 2410 size models.
Packaging
1,000 pcs in 7 inches dia. reel, 12mm wide tape, EIA Standard 481